thermal-limited
1 heat concentrates in power-delivery + package 2 SiC cuts switching losses; substrate k moves heat out 3 lower thermal resistance to lower junction temp 4 to higher power density + frequency, smaller cooling 5 Coherent: conductive high-k 300mm SiC substrate 6 upside: SiC as accelerator interposer (Rubin via CoWoS; TSMC 12-inch)
Heat removal gates AI power density: the SiC thermal path Coherent is selling PSU power stages 48V-to-core conversion GPU power delivery die + package / interposer SiC MOSFET Tj high heat backs up heat out substrate k heat conduit Coherent 300mm SiC conductive high-k substrate system heat sink server: fins, cold plate cooling airflow thermal-limited junction hotter power density capped thermal-enabled lower Tj, higher power density freq up, smaller cooling upside: SiC as accelerator interposer Rubin via CoWoS; TSMC 12-inch