Volume-conversion swing
Wafer-level burn-in adoption to order flow, gated by pilot volume conversion FOX wafer-level burn-in chamber AI chip value up yield risk → burn-in AI pilot benchmark beats package-level to pilot validation WaferPak full-wafer contact full-wafer die grid Follow-on orders $22M follow-on FOX-XP photonics Bookings + backlog Q4 record $60.7M backlog ~$100.6M backs FY27 $130-150M Volume conversion pilot-to-volume pilots repeat into production One-off pilots only orders stay thin EPS stays pressured Repeat production volume converts margin ~45% FY28 EPS delivered