SiC two-market split: EV price erosion vs AI data-center pull
SiC substrate
SiC boule
wafer slices
200mm SiC device fab
SiC MOSFET cross-section
mix
EV / industrial power
revenue-weighted
200mm competitor supply
softer EV demand
device price erosion
AI DC + high-voltage
new device generations
dedicated DC team
aero MOU · DC collab
erosion
pull
Turnaround stalls
revenue stays flat
margins stay negative
Margin recovery
pricing power returns
fab utilization up
GM → breakeven
SiC mix lever
EV-heavy mix
Balanced
AI reweighted
EV erosion outpaces AI pull — turnaround stalls